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Burn-in test sockets

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Burn-In Test

We offer an extensive catalog of finished sockets that are ready to fulfill burn-in, humidity, failure analysis, and test requirements for the latest packaged devices, including QFN, LGA, BGA and μBGA.

We control the entire process to give customers a high-quality, cost-effective socket solution with a quick turnaround.

Whether your package matches perfectly with a socket in our current catalog, or you need a custom product for your innovation, Plastronics has the technology and the expertise to determine and deliver the right solution for you.

Semiconductor Test

C-Series H-Pin® Socket

C-Series H-Pin® Socket is a modular burn-in socket with clamshell-style lid.

D Series H-Pin® Socket

D-Series H-Pin® Socket is a performance burn-in socket, with a clamshell-style lid that can be equipped with a heater and thermal sensor.

ES Micro Series H-Pin® Socket

ES Micro Series Socket is a technological advancement in the burn-in socket segment, with a dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated.

ES Series H-Pin® Socket

ES family Series of sockets extended the scope of a burn-in socket.

ESJ Series H-Pin Socket

ESJ Series socket is a high-performance burn-in socket, with dual latch clamshell lid to provide co-planar pressure on the DUT when the lid is actuated.

H-Pin®

The H-Pin is a stamped spring probe with the mechanical, electrical, and thermal performance of a spring probe, and the ease of use and high volume manufacturability of a stamped contact.

K Series H-Pin® Socket

The K-Series socket is designed to apply flat even pressure on the DUT with a secondary lever once the lid has been closed.

M-Series H-Pin® Socket

M-Series socket has long been the gold standard for reliability and out-of-the-box performance burn-in sockets.

Q-Series H-Pin® Socket

The Q-Series socket is available for mid to large package sizes.

QN-Series

Accelerated life testing solution