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R-Series H-Pin® Socket

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  • Auto IC loading / un-loading compatible
  • High temperature materials for above 200 °C applications
  • Drop-in replacement for legacy products
  • Series Info
  • RE
  • 5 mm to 9 mm package size range for QFN, LGA, and BGA
  • R
  • 10 mm to 14 mm package size range for QFN and LGA
  • 10 mm to 13 mm package size range for BGA
  • Drop in replacement for legacy designs
  • RL
  • 16 mm to 19 mm package size range for QFN, LGA, and BGA
  • H Pin Technology
  • Each socket uses the H-Pin contact technology providing wide RF performance capabilities and exceptional DC characteristics.
  • The Q-Series socket checks all the boxes: high frequency, high current, high temperature, low inductance, and low loss.
  • These features contribute to lower the cost of tests.

The R-Series product line is an open-top reliability socket used for accelerated life testing. With versions of the compression mount open-top design available as a drop-in replacement for other legacy products on the market, there is no need to purchase new burn-in boards. The open-top design allows for autoloading, and un-loading of the integrated circuit. The small socket footprint outline allows you to utilize the full resources available in the burn-In system for each burn-in board.

  • Industry-proven design, In-house tooling, molding and machining with 100% automated assembly.
  • Extensive catalog of components, configurable options
  • H-Pin offers unmatched DC performance
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