Smiths Interconnect KVPX connector is a shielded, high-density, high-speed, modular interconnect system optimized for differential pair architectures on a 1.8mm x 1.35mm grid. The waferized daughter-card assembly also provides single-ended and power wafer options. The backplane modules are available in 8 and 16 row increments on a 1.8mm x 1.8mm grid, with user-configurable keying and integrated stainless steel guide pin/keys. The KVPX connector platform offers the ability to scale from 80 Mbps to over 10 Gbps while retaining the same Vita 46 backplane slot pitch at 20.3mm to 25.4mm.
Through the use of the proven 0.40mm Hypertac® hyperboloid contact, KVPX connectors provide immunity to shock and vibration fretting, numerous linear paths of contact, and a self-cleaning wipe action that results in consistently better signal integrity for high reliability applications across a wide range of industries. The Hypertac contact system offers low insertion and extraction forces, low contact resistance, as well as industry leading mating cycles. Manufactured with 30 percent glass filled liquid crystal polymer (LCP) insulators and potted contacts, KVPX connectors withstand the high temperatures associated with soldering. The LCP insulators also exceed NASA space requirements for outgassing and have inherent keying features to prevent improper mating.
KVPX Series connectors perform under the most severe conditions, giving them the edge in demanding critical applications for military, aerospace, industrial, and medical devices.
Additional Features:
Differential, single-ended and power
Separable interface offering 70 single-ended signals/25.4mm and 63 differential signals/25.4mm
Reliable, Hypertac® Hyperboloid contact technology
ESD protection supports 2 level maintenance designs
0.56 mm (.022 in) diameter via for backplane connector
Current Rating: 12.5 A per power wafer and 1.5625 A per contact