- Frequency Range from DC to 26.5 GHz
- Extreme High Power to Size Ratings
- Peak Power Performance
- Small Size and Weight
- Power Handling up to 300 Watts
- CVD Diamond Substrates
- Tuned Versions Available
- Solderable or Bondable Gold Terminals
- Integrated Heat Sink
- Tab Launch
- Surface Mount Available
- Tape and Reel Packaging Available
- High Reliability Versions Available
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CVD Diamond Terminations
Smiths Interconnect|EMC's exclusive line of CVD Diamond terminations offers a unique combination of extreme high power ratings in very small packages. These terminations may be used in applications from DC to 26.5 GHz and are ideal for applications requiring high power capability and small, light-weight package size. The Diamond chip terminations are manufactured using all thin film construction and have a gold finish that is both wire bondable and solderable. This total thin film construction also makes them ideal for peak power applications. The “T” units have a gold plated copper tab for ease of installation. The “FT” series units are equipped with a gold plated copper tab and integrated heat sink for ease of mounting.
Because of their total thin film construction they are ideal for peak power applications. Standard chip and high reliability tested versions based on Mil-PRF-55342 are also available. Select from tape and reel or waffle packaging. These products are lead free, RoHS complaint and S-level approved.
CVD Diamond Terminations | ||||
CT0402D | CT0505D | CT0603D | CT0603DW2 | |
Package Style | Planar / Bondable | Planar / Bondable | Planar / Bondable | Surface-Mount Chip |
Operating Frequency | DC - 26.5 GHz | DC - 20.0 GHz | DC - 28.0 GHz | DC - 18.0 GHz |
Impedance | 50 Ω | |||
VSWR, Typical | 1.30 | 1.60 | 1.60 | 1.2 ? |
Power Handling | 10 W | 50 W | 50 W | 30 W |
Operating Temperature | -55ºC to 150ºC | |||
Size | 1.14 mm x 0.64 mm | 1.40 mm x 1.40 mm | 1.68 mm x 0.89 mm | 1.66 mm x 0.89 mm |
Substrate | CVD Diamond | |||
Resistive Material | Thin Film (Tantalum Nitride) | |||
Terminal Material | Gold / Nickel | |||
Data Sheet | 1011105 | 1010525 | 1011535 | 1013405 |
CT1310D | CT2010D | CT0505DTB | CT1310DT | |
Package Style | Planar / Bondable | Planar / Bondable | Tabbed Chip | Tabbed Chip |
Operating Frequency | DC - 14.0 GHz | DC - 12.4 GHz | DC - 20.0 GHz | DC - 14.0 GHz |
Impedance | 50 Ω | |||
VSWR, Typical | 1.40 | 1.3? | 1.60 | 1.50 |
Power Handling | 125 W | 300 W | 50 W | 125 W |
Operating Temperature | -55ºC to 150ºC | -55ºC to 125ºC | ||
Size | 3.33 mm x 2.67 mm | 5.21 mm x 2.67 mm | 1.42 mm x 1.42 mm | 3.30 mm x 2.67 mm |
Substrate | CVD Diamond | |||
Resistive Material | Thin Film (Tantalum Nitride) | |||
Terminal Material | Gold / Nickel | |||
Data Sheet | 1010545 | 1013505 | 1013175 | 1015435 |
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