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CVD Diamond Terminations

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CVD Diamond Terminations
  • Frequency Range from DC to 26.5 GHz
  • Extreme High Power to Size Ratings
  • Peak Power Performance
  • Small Size and Weight
  • Power Handling up to 300 Watts
  • CVD Diamond Substrates
  • Tuned Versions Available
  • Solderable or Bondable Gold Terminals
  • Integrated Heat Sink
  • Tab Launch
  • Surface Mount Available
  • Tape and Reel Packaging Available
  • High Reliability Versions Available

Smiths Interconnect|EMC's exclusive line of CVD Diamond terminations offers a unique combination of extreme high power ratings in very small packages. These terminations may be used in applications from DC to 26.5 GHz and are ideal for applications requiring high power capability and small, light-weight package size. The Diamond chip terminations are manufactured using all thin film construction and have a gold finish that is both wire bondable and solderable. This total thin film construction also makes them ideal for peak power applications. The “T” units have a gold plated copper tab for ease of installation. The “FT” series units are equipped with a gold plated copper tab and integrated heat sink for ease of mounting.

Because of their total thin film construction they are ideal for peak power applications.  Standard chip and high reliability tested versions based on Mil-PRF-55342 are also available. Select from tape and reel or waffle packaging. These products are lead free, RoHS complaint and S-level approved.

  CVD Diamond Terminations
  CT0402D CT0505D CT0603D CT0603DW2
Package Style Planar / Bondable Planar / Bondable Planar / Bondable Surface-Mount Chip
Operating Frequency DC - 26.5 GHz DC - 20.0 GHz DC - 28.0 GHz DC - 18.0 GHz
Impedance 50 Ω
VSWR, Typical 1.30 1.60 1.60 1.2 ?
Power Handling 10 W 50 W 50 W 30 W
Operating Temperature -55ºC to 150ºC
Size 1.14 mm x 0.64 mm 1.40 mm x 1.40 mm 1.68 mm x 0.89 mm 1.66 mm x 0.89 mm
Substrate CVD Diamond
Resistive Material Thin Film (Tantalum Nitride)
Terminal Material Gold / Nickel
Data Sheet 1011105 1010525 1011535 1013405

 

  CT1310D CT2010D CT0505DTB CT1310DT
Package Style Planar / Bondable Planar / Bondable Tabbed Chip Tabbed Chip
Operating Frequency DC - 14.0 GHz DC - 12.4 GHz DC - 20.0 GHz DC - 14.0 GHz
Impedance 50 Ω
VSWR, Typical 1.40 1.3? 1.60 1.50
Power Handling 125 W 300 W 50 W 125 W
Operating Temperature -55ºC to 150ºC -55ºC to 125ºC
Size 3.33 mm x 2.67 mm 5.21 mm x 2.67 mm 1.42 mm x 1.42 mm 3.30 mm x 2.67 mm
Substrate CVD Diamond
Resistive Material Thin Film (Tantalum Nitride)
Terminal Material Gold / Nickel
Data Sheet 1010545 1013505 1013175 1015435
  • Radar
  • Broadcast
  • High Power Filters
  • High Power Amplifiers
  • Instrumentation
  • Isolators
  • Satellite Communications