- Frequency Range from DC to 6 GHz
- Power Handling up to 250 Watts
- Choose BeO, ALN, Alumina and CVD Diamond Substrates
- Tin/Lead, Lead Free, or Solder Fused Plated
- Tape and Reel Packaging Available
- High Reliability Versions Available
You are here
SMT Chip Terminations
Smiths Interconnect|EMC offer a wide selection of SMT chip terminations handling input power levels up to 250W and covering frequency ranges up to 6 Ghz. Using Smiths Interconnect|EMC’s patented asymmetrical wrap geometry, the thermal dissipation of the surface mount termination is improved by increasing the solderable grounding area. This eliminates the need for bolt down heat sinks and tabs, thereby reducing assembly costs.
| SMT Chip Terminations | |||||||
| Operating Frequency | VSWR | Max. Power | Length | Width | Substrate | Data Sheet | |
| SMT1206AF | DC - 6.0 GHz | 1.25 | 8 W | 3.05 mm | 1.42 mm | Alumina | SMT1206AF |
| SMT1206ALNF | DC - 2.5 GHz | 1.25 | 10 W | 3.05 mm | 1.52 mm | AlN | 1011955 |
| SMT2010TALNF | DC - 4.0 GHz | 1.20 | 20 W | 5.08 mm | 2.54 mm | AlN | 1010605 |
| SMT252503ALN2F | DC - 4.0 GHz | 1.20 | 150 W | 6.35 mm | 6.35 mm | AlN | SMT252503ALN2F |
| SMT372503ALN2F | DC - 2.2 GHz | 1.20 | 200 W | 9.40 mm | 6.22 mm | AlN | SMT372503ALN2F |
| SMT3725TALNF | DC - 2.7 GHz | 1.15 | 100 W | 9.53 mm | 6.22 mm | AlN | SMT3725TALNF |
- Broadcast (TV and Radio)
- High Power Amplifier
- High Power Filters
- Instrumentation
- Isolators
- Remote Termination
- Satellite Communication
- Splitters / Combiners