Smith Interconnect is pleased to announce its participation in SEMICON Taiwan 2024, taking place from September 4-6 in Taipei under the theme "Breaking Limits: Powering the AI Era." This year's event promises to be the largest yet, featuring over 1,100 companies across 3,700 booths.
SEMICON Taiwan 2024 will spotlight key topics such as advanced processes, compound semiconductors, silicon photonics, and smart mobility, showcasing the semiconductor industry's critical role in supporting the AI revolution.
The evolution of AI chips, with their increasing computational power, is driving a demand for more integrated transistors, resulting in chips with areas up to 878 mm² and approximately 25,000 pins. These specifications present significant challenges in developing robust testing solutions, necessitating exceptional hardware design and high stability in complex scenarios.
Amid this backdrop, Smith Interconnect, a leader in the semiconductor testing industry, will showcase a range of flagship testing products and AI testing solutions at SEMICON Taiwan 2024. We invite both new and existing customers to visit us at Hall 1 Booth 3190 and explore our innovative offerings.
Smith Interconnect is pleased to announce its participation in SEMICON Taiwan 2024, taking place from September 4-6 in Taipei under the theme "Breaking Limits: Powering the AI Era." This year's event promises to be the largest yet, featuring over 1,100 companies across 3,700 booths.
SEMICON Taiwan 2024 will spotlight key topics such as advanced processes, compound semiconductors, silicon photonics, and smart mobility, showcasing the semiconductor industry's critical role in supporting the AI revolution.
The evolution of AI chips, with their increasing computational power, is driving a demand for more integrated transistors, resulting in chips with areas up to 878 mm² and approximately 25,000 pins. These specifications present significant challenges in developing robust testing solutions, necessitating exceptional hardware design and high stability in complex scenarios.
Amid this backdrop, Smith Interconnect, a leader in the semiconductor testing industry, will showcase a range of flagship testing products and AI testing solutions at SEMICON Taiwan 2024. We invite both new and existing customers to visit us at Hall 1 Booth 3190 and explore our innovative offerings.
