- High density, lightweight PCB connector
- 2000 mating cycles
- Polarised and scoop proof insulatorLow component count & low insertion force
- IP67 sealing when mated
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HDLP
HDLP is a high density, lightweight signal connector specifically designed for applications where space and weight is at a premium for board to board interconnections. HDLP range of rectangular PCB connectors are designed for use in space-constrained applications that require low mating force, a high number of mating cycles, low and stable contact resistance, and excellent fretting corrosion resistance. With IP67 sealing when mated, the HDLP series is particularly suitable for missile guidance and propulsion systems, ruggedized computer systems, camera or display applications, and communications panels and enclosures.
Available in variants that include PCB-to-PCB, PCB-to-flying-lead and PCB-to-flex, the HDLP series is designed to reduce the PCB real estate necessary for making data connections. PCB-to-PCB options include stacking and card-edge versions, for even greater flexibility. The connectors include an interfacial seal and encapsulated contacts to achieve a high level of sealing, with optional conformal coating available to provide further environmental integrity.
Specifications
| Contact Diameter | 0.39 mm/0.015 inches |
| Contact Life Cycles | 2,000+ operations |
| Temperature Range | -55°C to125°C |
| Current Rating | 2 A per contact |
| Voltage Rating | 110 VDC or AC peak nominal |
| Contact Resistance | 8 milliohms max. |
| Extraction Forces | 28.3 gr./ 1.0 oz. |
Materials
| Insulator Material | Liquid Crystal Polymer (LCP) |
| Contact Material | Copper Alloy |
| Contact Plating | ASTM-488-B (Type III, grade C, Class 1) |
| Socket Wire Material | Beryllium Copper |
| Interfacial Seal Material | Fluorosilicone |
| Guides Material | Stainless steel |
All specifications are subject to change without notice