Offset-grid contact layout, four contact rows within dielectric connector body
1.905 mm center-to-center contact spacing in each row and 1.905 row-to-row spacing.
0.6 mm nominal pin DIA contact size; 42 to 316 contact positions; dip solder and SMT soldering contact termination types.
High contact density, low connector weight, lowmating force. High shock and vibration proof (no micro interruptions - test: 2ns).
Conforms to MIL-DTL-55302 general requirements,and TPR 02013.
| Number of Rows/Ways | 6 |
| Pitch | 1.905 chevron pattern |
| Contact Positions | 150, 200, 300, 450 |
| Contact Termination | Straight through board solder, SMT |
| Nominal Current | 4 A |
| Nominal Pin Dia. | 0,6 |
| Qualification | MIL-DTL-55302 |
| Number of Rows | 4 |
| Pitch | 1.905 offset grid |
| Contact Positions | 42 to 316 |
| Contact Termination | Right angle through board solder, Straight through board solder, Flex circuit |
| Nominal Current | 3 A |
| Nominal Pin Dia. | 0,6 mm |
| Contact Resistance | 5.0 mΩ maximum individual |
| Qualifications | MIL-DTL-55302, TPR 02013, ESA ESCC 3401 |
All specifications are subject to change without notice
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