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High Power Chip Terminations

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High Power Chip Terminations
  • Frequency Range from DC to 26.5 GHz
  • Power Handling up to 250 Watts
  • Choose BeO, ALN, Alumina and CVD Diamond Substrates
  • Tin/Lead, Lead Free, or Solder Fused Plated
  • Tape and Reel Packaging Available
  • High Reliability Versions Available

Smiths Interconnect|EMC's high power chip terminations are available in both thick film and thin film resistor designs, offering you flexibility needed to match the correct part more closely to your specific application. All designs have been optimized for RF performance and thus minimize the variability of capacitive reactance. Localized hot spots associated with trimming have been minimized to ensure reliable operation under high temperature. Low part-to-part variation means your circuit performs consistently and eliminate the need for external tuning.

These high power chip terminations feature a ground edge wrap to facilitate maximum heat dissipation and are ideal for circulator and combiner applications.

High Power Chip Terminations 
Part NumberOperating FrequencyVSWRMax. PowerLengthWidthSubstrateData Sheet
82A3059FDC - 2.5 GHz1.20250 W9.53 mm6.35 mmBeO82A3059F
CT1206ALNFDC - 4.0 GHz1.2515 W3.05 mm1.52 mmAlN1010145
CT2010ALNFDC - 4.0 GHz1.2520 W5.08 mm2.54 mmAlN1010135
CT2335HDC - 8.0 GHz1.25100 W5.84 mm8.89 mmBeOCT2335H
CT3725ALNFDC - 2.0 GHz1.25150 W9.40 mm6.22 mmAlN1010715
CT3737TALNFDC - 3.0 GHz1.15180 W9.45 mm9.45 mmAlN1010995
  • Broadcast (TV and Radio)
  • High Power Amplifier
  • High Power Filters
  • Instrumentation
  • Isolators
  • Remote Termination
  • Satellite Communication
  • Splitters / Combiners