- Substrates - Alumina
- Commercial and High Reliability Product Lines
- Frequency Range from DC to 20 GHz
- Attenuation Values from 0 to 10dB
- Space Qualified
- Surface mount or bondable configurations
- RoHS options available
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TS09 Series Chip Attenuators
Smiths Interconnect|EMC's TS09 chip attenuators offer rated input power of 200 miliwatts with attenuation values from 0 dB to 10 dB in frequencies from DC to 20 GHz. This product is available with various metallization styles and plating options including RoHS compliant silver over nickel, solder plated with SN62 tin/lead, or SN62 solder fused for easy reflow processing. The WB2 style uses thick film wire-bondable gold terminals.
| TS09 Series Chip Attenuators | ||
| Package Style | ||
| Surface-Mount | Wire-Bondable | |
| Operating Frequency | DC - 20.0 GHz | |
| Impedance | 50 Ω | |
| VSWR, Typical | 1.40 | 1.30 |
| Power Handling | 200 mW | |
| Operating Temperature | -55ºC to 150ºC | |
| Size | 1.52 mm x 1.91 mm | |
| Substrate | Alumina | |
| Resistive Material | Thick Film | |
| Terminal Material | Thick Film | |
| Terminal Finish (Link to Data Sheet) | Solder Plated | Wire-Bondable Gold |
| Silver / Nickel | ||
- Circulators
- High Power Amplifiers
- Receivers
- Filters
- Isolators
- Signal Sampling
- Interstage Isolation
- Impedance Matching